摘要：薄膜沉积时，原子的入射角度、衬底材质等严重影响着薄膜的结构与性能特征，为此本文采用磁控溅射系统，通过改变入射角度对不同衬底上铜原子的沉积进行了研究。然后利用金相显微镜、扫描电子显微镜（SEM）、台阶仪等分析了铜沉积物的结构和形貌。最后对不同入射角度下铜原子在衬底上的沉积机理进行了分析。研究结果表明：（1）在玻璃衬底上，当入射角度θ=27°时，成功制备了一种铜纳米线/铜膜复合结构，而其它角度和衬底均不利于复合结构的形成；（2）在铜纳米线/铜膜复合结构中，铜纳米线取向一致、平行于衬底镶嵌在金属铜膜表面；（3）铜纳米线/铜膜复合结构的形成机理是定向压应力效应；（4）我们提出了一种新的“层-线状“生长模式。

关键词：铜；小入射角沉积；铜纳米线/铜膜复合结构；层-线状生长

Abstract:During growth of films, the incident angle of atoms and the substrate influence greatly the structure and property of films. Thus in this paper the deposition behavior of copper atoms was investigated by changing the incident angle and the substrate in a magnetron sputtering system. The morphologies of as-deposited copper films were then characterized by metalloscope and scanning electron microscope. With analysis of the morphological features of copper films, the deposition mechanisms of copper atoms with different incident angles on different substrates were further studied. The detailed work and outstanding contributions are concentrated as in the following:

　　(1) Copper nanowires/film composite structures were successfully fabricated at the incident angle of 27° on glass substrate, while at other incident angles or on other substrates no such composite structure formed.

    (2) In the copper nanowires/film composite structures, copper nanowires with a unique orientation were parallel to the substrate and inlaid into the surface of a supporting copper film.

    (3) The formation mechanism of copper nanowires/film composite structures was directed compressive stress effect.

    (4) A completely new growth mode of layer-plus-wire growth was proposed in this paper.

Key words: copper; small incident angle deposition; copper nanowires/film composite structure; layer-plus-wire growth